Article from Emerald Insight:
Popcorning in Fully Populated and Plastic Ball Grid Array Packages perimeter
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IPC publishes new standard for handling, packing and storage of Print
IPC 1601 published Sep 09, 2010
IPC Delivers New Standard on Action, Packaging and Storage of Printed Boards.
Questions about HIC's (Humidity Indicator Cards)
Two of the "this weeks question" From IPC Vice President International Relations David Bergman about HIC's:
What is the correct usage of the humidity indicator card in J-STD-033 for EMS companies?
What are the guidelines for placement of the humidity indicator card and a dessicant package?
Can I bake components to higher temperatures than what is allowed in J-STD-033B?
A Tech Q of the Week two IPC deals with the the challenge of baking low temperature (40deg) carriers
But even if the carrier can handle baking up two 125deg, you still face the choise: do you want high Quality or high component availability
higher baking temperature = > shorter baking time = > high negative impact on Solderability
lower baking temperature = > longer baking times = > higher Stock retention and reduced flexibility
You can get both high Quality and availability!!
The key word here is reducing the number of bakings, and this is what you can get from using Welcrosoft MSD software
How can the Software do that?, the answer is managing the 8/12 hour short duration time, if you stay below these limits, you still get a stock Retention for resetting, but here we talk about up to 3, 3days, for baking, we are talking about up to 79 days!